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Jan 06	SF/E Series Technical Data - Uploaded! You can download SF/E Series Technical Data at "Downloads and Feedback." More

2011

Sep 27	Thermal Cutoff Brochure - Updated! You can download Thermal Cutoff Brochure at "Downloads and Feedback." More

Mar 10	NEC SCHOTT Corporate Brochure - Updated!

2010

Dec 17	Redesign of Board Structure

July 26	Hermetically Sealed Feedthroughs for Batteries – New Datasheet Now Available!

July 15	SCHOTT Receives ASME NQA-1 Certificate Nuclear Safety Division Completes AREVA’s Supplier Audit for USA and Beyond More

Mar 24	SCHOTT Exhibits Cutting-Edge Electronic Packaging and Optical Components at Optical Fiber Conference March 23, 2010 (at the Optical Fiber Communication Conference and Exposition in San Diego) - SCHOTT Electronic Packaging is exhibiting several electronic packaging products that meet the market demand for faster transmission speeds at the Optical Fiber Conference (OFC) this week. In addition, SCHOTT’s Advanced Optics group will present a variety of optical glass components. More

Mar 24	Breakthrough SCHOTT Transistor Outline Accommodates 25 Gbit/s March 23, 2010 (at the Optical Fiber Communication Conference and Exposition in San Diego) – SCHOTT Electronic Packaging today introduced the TO PLUS^®, a new high frequency Transistor Outline (TO) with enhanced performance for high-speed data rates of 25 Gbit/s. Using multiple TO PLUS^® provides the opportunity to use TO based products for 100G Ethernet. The TO PLUS^® package will also enable end users to keep their costs in check by utilizing existing assembly and manufacturing infrastructure. More

2009

Oct 19	Information on Technical Glass Powders now available online!

Oct 19	Information on TO Caps for UV Applications now available online!

July 30	MEMS tightly sealed with SCHOTT HermeS^TM NEC SCHOTT Components Corporation is developing a new 8" high via density wafer that features hermetically sealed electric feedthroughs for micro-electro-mechanical systems and is intending to launch this product in 2010 More

July 22	SAW Torque Sensors for Automotive SCHOTT has developed a unique new hermetic

July 15	SCHOTT HTCC and LTCC Design Rules now available online!

July 02	New! Zirconium-containing, low refractive glass for dental composites from SCHOTT

Apr 10	SCHOTT’s Electrical Penetration Assemblies for Nuclear Power Plants Maintenance-free Performance - New product information now available!

Mar 30	Seals for gas made from glass Glass-to-metal feedthroughs seal off the pumps of liquefied gas tankers.

Mar 30	SCHOTT Successfully Tests TO 56 PLUS® Packages to 25 Gigabit Capacity Glass-to-Metal Sealed Packages pass stringent Residual Gas Analysis tests: Ready to serve the increased performance requirements of higher bandwidth

Mar 24	Nano fine glass powder for beautiful teeth SCHOTT expands portfolio of glass powders for dental composites SCHOTT is the world’s leading manufacturer of special glass powders for dental fillings made of composite materials. At the IDS, the international technology group presented the world’s first “NanoFine” dental glass powder that consists of particles that are only 180 nanometers in size. For dentists and patients alike, finer filler materials mean longer lasting fillings and a more attractive appearance. Product developers also benefit from the extended material properties. More

Mar 24	New Hermetic Packaging and Sealing Technology Handbook available March 24, 2009 -- SCHOTT Electronic Packaging (EP) has launched a new edition of the “Hermetic Packaging and Sealing Technology” handbook. The updated version continues to provide a good insight into the company’s signature glass-to-metal sealing (GTMS) technology and now includes an overview and technical details of EP’s other hermetic packaging technologies in the portfolio. More

2008

Dec 03	Ready for High-speed Datacom SCHOTT Lays Foundation for 17 Gbit/s Applications with TO PLUS Line The fiber channel protocol offers plenty of potential for meeting the rising data transmission requirements. SCHOTT Electronic Packaging now offers a hermetic Transistor Outline (TO) ready to serve tomorrow’s Fiber Channel applications of 17 gigabits/second and beyond. More

Aug 29	SCHOTT Electronic Packaging to launch Aspherical Lens Caps Customizable designs with a variety of proprietary low Tg glasses In a move to provide its international customers in the data and telecommunications fields with more complete solutions from a single vendor, SCHOTT Electronic Packaging has announced the introduction of Aspherical Lens Caps. This new product has a low Tg glass molded asphere sealed into a machined body (typically TO cap) using low temperature solder glass technology, which is well proven and established in the industry. More

May 16	NEC SCHOTT Components Corporation in Japan on YouTube (filmed by Deutsche Welle TV)

Feb 25	SCHOTT TO 56 PLUS^® Addresses Growing Demand for 10 G Technologies Exhibit at OFC/NFOEC Demonstrates SCHOTT TO 56 PLUS^®ESupport for High Frequency Applications and more I/O No Need for Manufacturers to Update or Alter Their Welding Machines, Bonders, Fiber Couplings and Other Production Line Equipment More

Feb 25	SCHOTT’s Electronic Packaging Business Launches New Website SCHOTT's Electronic Packaging (EP) business launched a new, updated website at www.schott.com/epackaging. More

Feb 01	NEC SCHOTT Inaugurates New Corporate Headquarters In Minakuchi The electronic components maker NEC SCHOTT, a joint venture between NEC Corporation of Japan and the technology group SCHOTT of Germany, intensifies its commitment to the its customers. More

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