Hybrid / Micro-electronic Packages

The term "hybrid package" or "microelectronic package" refers to the hermetically sealed packaging of encapsulated and non-encapsulated components in one container. In contrast to, for instance TO packages, these packages can be used to package not only a single component, but also several components. The term "microelectronic package" is generally used if it is not possible to protect the component to be encapsulated using standard packaging, due to a special required number or arrangement of feedthroughs.

Microelectronic packaging is used particularly for packaging small- to medium-sized batches of fully electronic circuits. They are used in purely electronic and opto-electronic applications, as well as increasingly in Micro-Electro-Mechanical Systems (MEMS).

We offer two different technical microelectronic packaging solutions:

Glass-to-Metal Seals (GTMS): The combination of glass and metal is suitable for all common applications
Ceramic-to-Metal Seals (SCHOTT CerTMS^®): The use of special types of ceramics is ideal for packaging circuits with special contact density and signal wiring requirements.

In combination, these technologies hold the great potential for an entirely new range of customer-specific solutions.

Multilayer Ceramic Packages
SCHOTT Electronic Packaging is the only company in Europe that supplies all types of hermetic housing technologies... [more]

GTMS Packages
In addition to the standard types of packaging such as TO packages, there is a whole range of other more complex GTMS packages with outstanding functionalities... [more]

SCHOTT CerTMS^® Packages
The current trend of miniaturization in the electronics and communication sectors continues unabatedly... [more]