At the physical layer, most wired Ethernet implementations use copper twisted-pair cables. More recent implementations (especially high-speed ones) use fiber optics. At the interface between these optical and electrical networks, glass-to-metal sealed hybrid or microelectronic packages, high-frequency Transistor Outlines (SCHOTT TO PLUS®) and ceramic-to-metal sealed (SCHOTT CerTMS®) packaging components are equipped with windows and lenses to meet complex connection demands for high speed data processing, supporting data rates of up to 40 Gbits⁄s. |
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TO Headers Providing a mechanical basis for the installation of electronic and optical components ... [more] |
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TO Caps TO Caps are used to fulfill two primary functions. First, they reliably and permanently protect … [more] |
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Hybrid / Microelectronic Packages These refer to the hermetically sealed packaging of encapsulated … [more] |
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Products for High Frequency Applications Data communication networks are becoming increasingly faster. However, data can only be transferred at high speed if all… [more] |









