NEC SCHOTT - MEMS Packaging

Micro-Electro-Mechanical systems (MEMS) are a type of technology related to very small (micron size) mechanical elements or 'machines.' They are widely used as sensors and switches in the automotive and avionics industries as well as in biomedical applications and data communication.

The package is one of the most important components of a MEMS solution. It protects the functional unit (sensor, integrated circuit (IC) or micromechanical component) against disruptive external influences.

We offer

Glass cover discs for cavity packaging
Small glass-to-metal sealed (GTMS) packages with cavities (DIPs, TO, Thin Metal)
Hermetic packages for the encapsulation of electronic components and quartz crystals
SCHOTT HermeS™, a packaging innovation specially designed for MEMS

SCHOTT HermeS™
Specially designed for use in MEMS, SCHOTT HermeS™ offers superior hermeticity and enhanced electrical properties... [more]

TO Headers
Providing a mechanical basis for the installation of electronic and optical components such as semiconductors, laser diodes or simple electronic circuits, while at the same time providing power to the encapsulated components with the aid of pins, TO headers... [more]

Glass Discs
SCHOTT offers small glass windows for a variety of optical and optoelectronic applications... [more]

Frequency Control
Quartz crystals are sensitive components found within time control devices. Demanding environmental conditions can severely impair their performance. SCHOTT offers hermetically sealed enclosures to ... [more]