Wafer Technology | NEC SCHOTT

Concept

SCHOTT Electronic Packaging focuses on the customer-specific micro-structuring of (ultra-thin) wafers with through-holes, blind holes, cavities and channels with diverse depth requirements on both sides of a wafer. Wafers are produced by floating or down-drawing, allowing the use of various special glass types. After cutting and polishing, the wafers are structured under clean room condition. By sandblasting or ultrasonic drilling, the wafers receive their customer-specific micro-structures. Then the wafers are cleaned and packed under clean room conditions class 1,000.

Advantages of the Technology

Compared to polymers, glass is hydrophilic, robust, chemically and highly temperature resistant
Compared to silicone, glass is less costly and offers an optimum CTE to match the silicone as well as high isolation and excellent optical properties
SCHOTT offers standard glasses such as D263®, BF33™, B 270^® and AF371™ as well as a wide range if other glass types according to customer specific requirements
Micro-structured wafers are produced under clean room conditions (Clean Room Class 10,000 ISO Category 7; US Federal Standard 209E; DIN EN 150 14644-1) and packed under clean room conditions class 1,000.

Applications

SCHOTT offers micro-structured wafers made of different glass types that are used in applications such as:

Micro-fluidic devices for medical analysis, drug testing, industrial monitoring and ink-jet printing
Micro-Electro-Mechanical Systems (MEMS)
Organic Light Emitting Diodes (OLED)
Customer-specific applications